USED DN SOLUTIONS XG 800

The DN Solutions XG 800 is a high-precision CNC turning and grinding center specifically engineered for machining advanced materials such as silicon carbide (SiC), quartz, ceramics, sapphire, and other brittle materials used in semiconductor, electronics, optics, aerospace, and scientific equipment manufacturing. Developed as the larger-capacity model in the XG Series, the XG 800 combines conventional turning with high-speed precision grinding, allowing manufacturers to complete multiple machining processes in a single setup while achieving exceptional dimensional accuracy and surface finishes. The machine features a 12-inch chuck, a maximum machining diameter of approximately 800 mm (31.5 inches), and an integrated 5,000 RPM grinding spindle, making it an ideal solution for large, high-value precision components.

Unlike conventional CNC lathes, the XG 800 is purpose-built for precision grinding applications involving hard and brittle materials. The machine utilizes a rigid box guideway construction with an optimized X-axis support structure to minimize vibration during heavy grinding operations. This enhanced rigidity enables manufacturers to maintain micron-level accuracy while significantly reducing defects and improving tool life when machining expensive materials. The integrated grinding spindle provides excellent cutting performance for both internal and external grinding applications while maintaining consistent thermal stability throughout extended machining cycles.

The XG 800 incorporates advanced CNC technology with C-axis control, allowing turning, grinding, boring, drilling, and precision finishing operations to be completed without removing the workpiece. Eliminating secondary setups improves part accuracy, shortens production cycles, and reduces handling damage, which is particularly important for fragile semiconductor-grade materials.

The machine also features an enclosed work area designed specifically for quartz and ceramic machining. Enhanced dust management, coolant filtration, slurry collection, and improved operator accessibility contribute to cleaner operation, longer machine life, and easier maintenance. The spacious machining area accommodates larger workpieces while simplifying loading, unloading, and tool changes.

Industries including semiconductor manufacturing, electronics, aerospace, optics, medical equipment, vacuum technology, research laboratories, and advanced ceramics manufacturing utilize the XG 800 for producing precision wafer processing components, quartz chambers, ceramic rings, silicon carbide parts, sealing rings, optical components, and numerous other high-value precision parts.

In the used CNC machinery market, the DN Solutions XG 800 has become increasingly desirable due to growing worldwide demand for semiconductor production equipment. Its specialized grinding capability, robust construction, exceptional accuracy, and significantly lower acquisition cost compared to new equipment make it an outstanding investment for manufacturers seeking advanced precision grinding technology.

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DN SOLUTIONS XG 800 – AXIS

Specification	Details
X-Axis Travel	20 in (500 mm)
Z-Axis Travel	20 in (500 mm)
Axis Configuration	2-Axis CNC
X-Axis Rapid Traverse	394 IPM (10 m/min)
Z-Axis Rapid Traverse	787 IPM (20 m/min)
Guideway Type	Heavy-Duty Box Guideways

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DN SOLUTIONS XG 800 – AXIS TRAVELS / WORK ENVELOPE

Specification	Details
Maximum Machining Diameter	31.5 in (800 mm)
Maximum Turning Diameter	31.5 in
Chuck Size	12 in
X-Axis Travel	20 in
Z-Axis Travel	20 in
Machine Configuration	CNC Turning & Grinding Center

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DN SOLUTIONS XG 800 – CAPACITY / TABLE

Specification	Details
Chuck Size	12 in
Maximum Machining Diameter	31.5 in
Maximum Workpiece Capacity	Large Precision Ceramic & Quartz Components
Table Type	Precision Turning Spindle
Application	Turning & Precision Grinding

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DN SOLUTIONS XG 800 – SPINDLE

Specification	Details
Main Spindle Speed	Up to 500 RPM
Grinding Spindle Speed	Up to 5,000 RPM
Main Spindle Power	Approx. 19 HP (14.1 kW)
Optional Grinding Motor	7.5 kW High-Power Option
Spindle Type	Precision Direct Drive
Grinding Capability	SiC, Quartz, Ceramic & Sapphire

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DN SOLUTIONS XG 800 – TOOL CHANGER

Specification	Details
Turret Stations	12
Grinding Spindle	Integrated
Automatic Tool Indexing	Yes
Tool Monitoring	Available
Grinding Wheel Management	Yes
Tool Offset Compensation	Yes

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DN SOLUTIONS XG 800 – CONTROL SYSTEM

Specification	Details
CNC Control	Fanuc Series
C-Axis Control	Standard
Grinding Cycles	Yes
Ethernet Connectivity	Available
USB Interface	Yes
Advanced Machining Functions	Yes

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DN SOLUTIONS XG 800 – COOLANT / DUST / WATER MANAGEMENT

Specification	Details
Flood Coolant	Standard
Grinding Coolant System	Integrated
Quartz Dust Protection	Enhanced
Slurry Collection System	Yes
Multi-Stage Filtration	Yes
Large Capacity Coolant Tank	Standard

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DN SOLUTIONS XG 800 – POWER REQUIREMENTS

Specification	Details
Electrical Supply	220V / 380V / 440V
Connected Load	Approx. 50 kVA
Air Requirement	Shop Air Required
Hydraulic System	Integrated
Main Disconnect	Industrial Grade

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DN SOLUTIONS XG 800 – DIMENSIONS

Specification	Details
Machine Length	Approx. 99 in (2,520 mm)
Machine Width	Approx. 71 in (1,805 mm)
Machine Height	Approx. 75 in (1,900 mm)
Machine Weight	Approx. 70,550 lbs (32,000 kg)

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DN SOLUTIONS XG 800 – GENERAL INFORMATION

Specification	Details
Manufacturer	DN Solutions
Model	XG 800
Machine Type	CNC Turning & Grinding Center
Condition	Used
Country of Origin	South Korea
Construction	Heavy-Duty Box Guideway Design
Primary Application	Precision Turning & Grinding

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WHY BUY USED DN SOLUTIONS XG 800

Purchasing a used DN Solutions XG 800 provides manufacturers with access to one of the industry’s most advanced turning and grinding platforms while significantly reducing capital investment. Designed specifically for semiconductor-grade materials such as silicon carbide, quartz, ceramics, and sapphire, the XG 800 offers exceptional machining capability that is difficult to achieve using conventional CNC lathes or standalone grinding machines.

One of the machine’s greatest strengths is its ability to combine turning and grinding operations into a single machining process. This eliminates multiple setups, improves dimensional consistency, reduces workpiece handling, and minimizes the risk of damaging fragile, high-value components. For manufacturers producing expensive semiconductor components, reducing scrap rates alone can justify the investment.

The machine’s rigid box guideway structure provides excellent vibration absorption during grinding operations, allowing manufacturers to maintain micron-level accuracy while extending grinding wheel life. Its reinforced X-axis support structure is specifically engineered to withstand the heavy side loads generated during grinding while maintaining exceptional positioning accuracy.

The XG 800 also offers outstanding operator convenience. The enlarged machining enclosure provides improved accessibility for loading oversized workpieces and changing tooling, while enhanced dust containment and slurry collection systems simplify maintenance and improve machine cleanliness. Integrated grinding cycles within the CNC control reduce programming complexity and improve process consistency.

Purchasing a used XG 800 also provides substantial financial benefits. Specialized semiconductor machining equipment commands premium pricing when purchased new. A well-maintained used machine offers virtually the same production capability at a fraction of the acquisition cost while benefiting from DN Solutions’ proven reputation for reliability and long-term durability.

For manufacturers serving semiconductor, optics, aerospace, medical, and advanced ceramics industries, a used XG 800 represents an outstanding opportunity to expand production capability while maximizing return on investment.

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HOW MUCH DOES A USED DN SOLUTIONS XG 800 COST?

The price of a used DN Solutions XG 800 depends on machine age, operating hours, grinding spindle condition, maintenance history, tooling packages, CNC configuration, and overall machine condition. Because the XG 800 is a highly specialized turning and grinding center designed for semiconductor manufacturing, it generally commands stronger resale values than conventional CNC lathes.

Most used DN Solutions XG 800 machines typically sell within a range of approximately $250,000 to $700,000. Older machines equipped with standard grinding packages generally occupy the lower portion of the pricing range, while newer machines with upgraded grinding spindles, advanced probing systems, automation interfaces, extensive tooling, and comprehensive maintenance records frequently command premium prices.

Machine condition remains one of the most important pricing factors. Buyers carefully evaluate grinding spindle accuracy, spindle vibration, guideway wear, machine geometry, coolant filtration systems, slurry management systems, lubrication systems, and overall machining performance. Machines capable of consistently maintaining micron-level tolerances generally achieve significantly higher resale values.

Optional equipment can substantially increase market value. High-power grinding packages, automatic grinding wheel management, in-process probing, advanced filtration systems, automation interfaces, semiconductor-specific tooling, and software upgrades frequently add considerable value while reducing future investment requirements.

Growing worldwide investment in semiconductor manufacturing continues to support strong resale values because relatively few machines offer the XG 800’s unique combination of large machining capacity, integrated turning and grinding capability, and specialized engineering for brittle advanced materials.

Although transportation, installation, and operator training costs should be considered, purchasing a used DN Solutions XG 800 remains significantly more economical than investing in comparable new precision grinding equipment while delivering world-class machining performance for advanced manufacturing applications.

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INDUSTRIES THAT USE DN SOLUTIONS XG 800

• Semiconductor Manufacturing
• Electronics Manufacturing
• Aerospace Industry
• Medical Device Manufacturing
• Optical Components Manufacturing
• Precision Ceramics Manufacturing
• Quartz Processing Industry
• Scientific Equipment Manufacturing
• Vacuum Technology
• Advanced Materials Processing
• Precision Engineering
• Research & Development

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TYPICAL PARTS DN SOLUTIONS XG 800 CAN PRODUCE

• Semiconductor Chamber Components
• Quartz Rings
• Silicon Carbide Components
• Ceramic Wafer Carriers
• Vacuum Chamber Parts
• Precision Ceramic Bearings
• Optical Mounts
• High-Purity Sealing Rings
• Wafer Processing Components
• Ceramic Sleeves
• Precision Bushings
• Scientific Instrument Components
• Laboratory Equipment Parts
• Advanced Ceramic Assemblies
• High-Precision Ground Components

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WHY CHOOSE DN SOLUTIONS XG 800

The DN Solutions XG 800 is an outstanding CNC turning and grinding center for manufacturers producing large, high-value components from advanced engineering materials. Its integrated turning and grinding capability, rigid box guideway construction, high-speed grinding spindle, advanced CNC control, and optimized vibration-resistant design deliver exceptional machining accuracy while reducing setup time and increasing production efficiency.

Whether manufacturing semiconductor components, quartz chambers, ceramic precision parts, optical assemblies, vacuum equipment, or advanced materials for next-generation technologies, the XG 800 provides the precision, reliability, and specialized machining capability required by today’s most demanding industries. Its advanced grinding technology, exceptional build quality, and strong resale value continue to make it one of the most desirable used CNC turning and grinding centers available.